TL-nvSRAM-CIM: Ultra-High-Density Three-Level ReRAM-Assisted Computing-in-nvSRAM with DC-Power Free Restore and Ternary MAC Operations

Dengfeng Wang, Liukai Xu, Songyuan Liu, Zhi Li, Yiming Chen, Weifeng He, Xueqing Li, Yanan Sun 0003. TL-nvSRAM-CIM: Ultra-High-Density Three-Level ReRAM-Assisted Computing-in-nvSRAM with DC-Power Free Restore and Ternary MAC Operations. In IEEE/ACM International Conference on Computer Aided Design, ICCAD 2023, San Francisco, CA, USA, October 28 - Nov. 2, 2023. pages 1-9, IEEE, 2023. [doi]

Abstract

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