A High-Efficiency Design Method of TSV Array for Thermal Management of 3-D Integrated System

Xianglong Wang, Yintang Yang, Dongdong Chen 0010, Di Li 0003. A High-Efficiency Design Method of TSV Array for Thermal Management of 3-D Integrated System. IEEE Trans. on CAD of Integrated Circuits and Systems, 42(6):1733-1741, June 2023. [doi]

Abstract

Abstract is missing.