Double-Pumping the Interconnect for Area Reduction in Coarse-Grained Reconfigurable Arrays - researchr publication authors

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Xinyuan Wang, Tianyi Yu, Hsuan Hsiao, Jason Helge Anderson. Double-Pumping the Interconnect for Area Reduction in Coarse-Grained Reconfigurable Arrays. In 32nd IEEE International Conference on Application-specific Systems, Architectures and Processors, ASAP 2021, Virtual Conference, USA, July 7-9, 2021. pages 242-249, IEEE, 2021. [doi]

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