Xinyuan Wang, Tianyi Yu, Hsuan Hsiao, Jason Helge Anderson. Double-Pumping the Interconnect for Area Reduction in Coarse-Grained Reconfigurable Arrays. In 32nd IEEE International Conference on Application-specific Systems, Architectures and Processors, ASAP 2021, Virtual Conference, USA, July 7-9, 2021. pages 242-249, IEEE, 2021. [doi]
@inproceedings{WangYHA21,
title = {Double-Pumping the Interconnect for Area Reduction in Coarse-Grained Reconfigurable Arrays},
author = {Xinyuan Wang and Tianyi Yu and Hsuan Hsiao and Jason Helge Anderson},
year = {2021},
doi = {10.1109/ASAP52443.2021.00043},
url = {https://doi.org/10.1109/ASAP52443.2021.00043},
researchr = {https://researchr.org/publication/WangYHA21},
cites = {0},
citedby = {0},
pages = {242-249},
booktitle = {32nd IEEE International Conference on Application-specific Systems, Architectures and Processors, ASAP 2021, Virtual Conference, USA, July 7-9, 2021},
publisher = {IEEE},
isbn = {978-1-6654-2701-2},
}