DDR4 Data Channel Failure Due to DC Offset Caused by Intermittent Solder Ball Fracture in FBGA Package

Muhammad Waqar, GeunYong Bak, Junhyeong Kwon, Sanghyeon Baeg. DDR4 Data Channel Failure Due to DC Offset Caused by Intermittent Solder Ball Fracture in FBGA Package. IEEE Access, 9:63002-63011, 2021. [doi]

Abstract

Abstract is missing.