On signalling over Through-Silicon Via (TSV) interconnects in 3-D Integrated Circuits - researchr publication authors

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Roshan Weerasekera, Matt Grange, Dinesh Pamunuwa, Hannu Tenhunen. On signalling over Through-Silicon Via (TSV) interconnects in 3-D Integrated Circuits. In Design, Automation and Test in Europe, DATE 2010, Dresden, Germany, March 8-12, 2010. pages 1325-1328, IEEE, 2010. [doi]

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