Roshan Weerasekera, Matt Grange, Dinesh Pamunuwa, Hannu Tenhunen. On signalling over Through-Silicon Via (TSV) interconnects in 3-D Integrated Circuits. In Design, Automation and Test in Europe, DATE 2010, Dresden, Germany, March 8-12, 2010. pages 1325-1328, IEEE, 2010. [doi]
@inproceedings{WeerasekeraGPT10,
title = {On signalling over Through-Silicon Via (TSV) interconnects in 3-D Integrated Circuits},
author = {Roshan Weerasekera and Matt Grange and Dinesh Pamunuwa and Hannu Tenhunen},
year = {2010},
url = {http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5457013},
researchr = {https://researchr.org/publication/WeerasekeraGPT10},
cites = {0},
citedby = {0},
pages = {1325-1328},
booktitle = {Design, Automation and Test in Europe, DATE 2010, Dresden, Germany, March 8-12, 2010},
publisher = {IEEE},
}