Ying Wei, Yi-Chieh Huang, Haiming Tang, Nithya Sankaran, Ish Chadha, Dai Dai, Olakanmi Oluwole, Vishnu Balan, Edward Lee. NVLink-C2C: A Coherent Off Package Chip-to-Chip Interconnect with 40Gbps/pin Single-ended Signaling. In IEEE International Solid- State Circuits Conference, ISSCC 2023, San Francisco, CA, USA, February 19-23, 2023. pages 160-161, IEEE, 2023. [doi]
@inproceedings{WeiHTSCDOBL23,
title = {NVLink-C2C: A Coherent Off Package Chip-to-Chip Interconnect with 40Gbps/pin Single-ended Signaling},
author = {Ying Wei and Yi-Chieh Huang and Haiming Tang and Nithya Sankaran and Ish Chadha and Dai Dai and Olakanmi Oluwole and Vishnu Balan and Edward Lee},
year = {2023},
doi = {10.1109/ISSCC42615.2023.10067395},
url = {https://doi.org/10.1109/ISSCC42615.2023.10067395},
researchr = {https://researchr.org/publication/WeiHTSCDOBL23},
cites = {0},
citedby = {0},
pages = {160-161},
booktitle = {IEEE International Solid- State Circuits Conference, ISSCC 2023, San Francisco, CA, USA, February 19-23, 2023},
publisher = {IEEE},
isbn = {978-1-6654-9016-0},
}