Ying Wei, Yi-Chieh Huang, Haiming Tang, Nithya Sankaran, Ish Chadha, Dai Dai, Olakanmi Oluwole, Vishnu Balan, Edward Lee. NVLink-C2C: A Coherent Off Package Chip-to-Chip Interconnect with 40Gbps/pin Single-ended Signaling. In IEEE International Solid- State Circuits Conference, ISSCC 2023, San Francisco, CA, USA, February 19-23, 2023. pages 160-161, IEEE, 2023. [doi]
Abstract is missing.