Microstructural evolution and shear strength of AuSn20/Ni single lap solder joints

Xiao-feng Wei, Yu-kun Zhang, Ri-chu Wang, Yan Feng. Microstructural evolution and shear strength of AuSn20/Ni single lap solder joints. Microelectronics Reliability, 53(5):748-754, 2013. [doi]

Authors

Xiao-feng Wei

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Yu-kun Zhang

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Ri-chu Wang

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Yan Feng

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