Xiao-feng Wei, Yu-kun Zhang, Ri-chu Wang, Yan Feng. Microstructural evolution and shear strength of AuSn20/Ni single lap solder joints. Microelectronics Reliability, 53(5):748-754, 2013. [doi]
@article{WeiZWF13,
title = {Microstructural evolution and shear strength of AuSn20/Ni single lap solder joints},
author = {Xiao-feng Wei and Yu-kun Zhang and Ri-chu Wang and Yan Feng},
year = {2013},
doi = {10.1016/j.microrel.2013.01.005},
url = {http://dx.doi.org/10.1016/j.microrel.2013.01.005},
researchr = {https://researchr.org/publication/WeiZWF13},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {53},
number = {5},
pages = {748-754},
}