Hsiang-Ting Wen, Yu-Jie Cai, Yang Hsu, Yao-Wen Chang. Via-Based Redistribution Layer Routing for InFO Packages With Irregular Pad Structures. IEEE Trans. on CAD of Integrated Circuits and Systems, 41(12):5554-5567, 2022. [doi]
@article{WenCHC22,
title = {Via-Based Redistribution Layer Routing for InFO Packages With Irregular Pad Structures},
author = {Hsiang-Ting Wen and Yu-Jie Cai and Yang Hsu and Yao-Wen Chang},
year = {2022},
doi = {10.1109/TCAD.2022.3155069},
url = {https://doi.org/10.1109/TCAD.2022.3155069},
researchr = {https://researchr.org/publication/WenCHC22},
cites = {0},
citedby = {0},
journal = {IEEE Trans. on CAD of Integrated Circuits and Systems},
volume = {41},
number = {12},
pages = {5554-5567},
}