Via-Based Redistribution Layer Routing for InFO Packages With Irregular Pad Structures

Hsiang-Ting Wen, Yu-Jie Cai, Yang Hsu, Yao-Wen Chang. Via-Based Redistribution Layer Routing for InFO Packages With Irregular Pad Structures. IEEE Trans. on CAD of Integrated Circuits and Systems, 41(12):5554-5567, 2022. [doi]

Abstract

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