Haoran Wen, Anosh Daruwalla, Yaesuk Jeong, Pranav Gupta, Jaehoo Choi, Chang-Shun Liu, Farrokh Ayazi. Wafer-level-packaged HARPSS+ MEMS platform: Integration of robust timing and inertial measurement units (TIMU) on a single chip. In IEEE/ION Position, Location and Navigation Symposium, PLANS 2018, Monterey, CA, USA, April 23-26, 2018. pages 261-266, IEEE, 2018. [doi]
Abstract is missing.