Thomas Whipple, Taranjit Kukal, Keith Felton, Vassilios Gerousis. IC-package co-design and analysis for 3D-IC designs. In IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, California, USA, 28-30 September 2009. pages 1-6, IEEE, 2009. [doi]
Abstract is missing.