Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation

Paul Wild, Dominik Lorenz, T. Grozinger, A. Zimmermann. Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation. Microelectronics Reliability, 85:163-175, 2018. [doi]

Authors

Paul Wild

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Dominik Lorenz

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T. Grozinger

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A. Zimmermann

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