Paul Wild, Dominik Lorenz, T. Grozinger, A. Zimmermann. Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation. Microelectronics Reliability, 85:163-175, 2018. [doi]
@article{WildLGZ18,
title = {Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation},
author = {Paul Wild and Dominik Lorenz and T. Grozinger and A. Zimmermann},
year = {2018},
doi = {10.1016/j.microrel.2018.04.014},
url = {https://doi.org/10.1016/j.microrel.2018.04.014},
researchr = {https://researchr.org/publication/WildLGZ18},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {85},
pages = {163-175},
}