Paul Wild, Dominik Lorenz, T. Grozinger, A. Zimmermann. Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation. Microelectronics Reliability, 85:163-175, 2018. [doi]
@article{WildLGZ18, title = {Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation}, author = {Paul Wild and Dominik Lorenz and T. Grozinger and A. Zimmermann}, year = {2018}, doi = {10.1016/j.microrel.2018.04.014}, url = {https://doi.org/10.1016/j.microrel.2018.04.014}, researchr = {https://researchr.org/publication/WildLGZ18}, cites = {0}, citedby = {0}, journal = {Microelectronics Reliability}, volume = {85}, pages = {163-175}, }