Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation

Paul Wild, Dominik Lorenz, T. Grozinger, A. Zimmermann. Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation. Microelectronics Reliability, 85:163-175, 2018. [doi]

Abstract

Abstract is missing.