Advances in the drop-impact reliability of solder joints for mobile applications

E. H. Wong, S. K. W. Seah, W. D. van Driel, J. F. J. M. Caers, N. Owens, Y.-S. Lai. Advances in the drop-impact reliability of solder joints for mobile applications. Microelectronics Reliability, 49(2):139-149, 2009. [doi]

Authors

E. H. Wong

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S. K. W. Seah

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W. D. van Driel

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J. F. J. M. Caers

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N. Owens

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Y.-S. Lai

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