Advances in the drop-impact reliability of solder joints for mobile applications

E. H. Wong, S. K. W. Seah, W. D. van Driel, J. F. J. M. Caers, N. Owens, Y.-S. Lai. Advances in the drop-impact reliability of solder joints for mobile applications. Microelectronics Reliability, 49(2):139-149, 2009. [doi]

Abstract

Abstract is missing.