E. H. Wong, S. K. W. Seah, W. D. van Driel, J. F. J. M. Caers, N. Owens, Y.-S. Lai. Advances in the drop-impact reliability of solder joints for mobile applications. Microelectronics Reliability, 49(2):139-149, 2009. [doi]
@article{WongSDCOL09,
title = {Advances in the drop-impact reliability of solder joints for mobile applications},
author = {E. H. Wong and S. K. W. Seah and W. D. van Driel and J. F. J. M. Caers and N. Owens and Y.-S. Lai},
year = {2009},
doi = {10.1016/j.microrel.2008.12.001},
url = {http://dx.doi.org/10.1016/j.microrel.2008.12.001},
tags = {reliability, mobile},
researchr = {https://researchr.org/publication/WongSDCOL09},
cites = {0},
citedby = {0},
journal = {Microelectronics Reliability},
volume = {49},
number = {2},
pages = {139-149},
}