Intra-channel Reconfigurable Interface for TSV and Micro Bump Fault Tolerance in 3-D RAMs - researchr publication authors

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Kuan-Te Wu, Jin-Fu Li, Yun-Chao Yu, Chih-Sheng Hou, Chi-Chun Yang, Ding-Ming Kwai, Yung-Fa Chou, Chih-Yen Lo. Intra-channel Reconfigurable Interface for TSV and Micro Bump Fault Tolerance in 3-D RAMs. In 23rd IEEE Asian Test Symposium, ATS 2014, Hangzhou, China, November 16-19, 2014. pages 143-148, IEEE Computer Society, 2014. [doi]

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