Kuan-Te Wu, Jin-Fu Li, Yun-Chao Yu, Chih-Sheng Hou, Chi-Chun Yang, Ding-Ming Kwai, Yung-Fa Chou, Chih-Yen Lo. Intra-channel Reconfigurable Interface for TSV and Micro Bump Fault Tolerance in 3-D RAMs. In 23rd IEEE Asian Test Symposium, ATS 2014, Hangzhou, China, November 16-19, 2014. pages 143-148, IEEE Computer Society, 2014. [doi]
@inproceedings{WuLYHYKCL14,
title = {Intra-channel Reconfigurable Interface for TSV and Micro Bump Fault Tolerance in 3-D RAMs},
author = {Kuan-Te Wu and Jin-Fu Li and Yun-Chao Yu and Chih-Sheng Hou and Chi-Chun Yang and Ding-Ming Kwai and Yung-Fa Chou and Chih-Yen Lo},
year = {2014},
doi = {10.1109/ATS.2014.42},
url = {http://dx.doi.org/10.1109/ATS.2014.42},
researchr = {https://researchr.org/publication/WuLYHYKCL14},
cites = {0},
citedby = {0},
pages = {143-148},
booktitle = {23rd IEEE Asian Test Symposium, ATS 2014, Hangzhou, China, November 16-19, 2014},
publisher = {IEEE Computer Society},
isbn = {978-1-4799-6030-9},
}