ILP-based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design

Jun-Sheng Wu, Chi-an Pan, Yi-Yu Liu. ILP-based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design. ACM Trans. Design Autom. Electr. Syst., 28(5), September 2023. [doi]

Authors

Jun-Sheng Wu

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Chi-an Pan

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Yi-Yu Liu

This author has not been identified. Look up 'Yi-Yu Liu' in Google