ILP-based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design

Jun-Sheng Wu, Chi-an Pan, Yi-Yu Liu. ILP-based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design. ACM Trans. Design Autom. Electr. Syst., 28(5), September 2023. [doi]

Abstract

Abstract is missing.