Jun-Sheng Wu, Chi-an Pan, Yi-Yu Liu. ILP-based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design. ACM Trans. Design Autom. Electr. Syst., 28(5), September 2023. [doi]
@article{WuPL23,
title = {ILP-based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design},
author = {Jun-Sheng Wu and Chi-an Pan and Yi-Yu Liu},
year = {2023},
month = {September},
doi = {10.1145/3579843},
url = {https://doi.org/10.1145/3579843},
researchr = {https://researchr.org/publication/WuPL23},
cites = {0},
citedby = {0},
journal = {ACM Trans. Design Autom. Electr. Syst.},
volume = {28},
number = {5},
}