Soft-pad grinding of 300 mm wire-sawn silicon wafers: finite element analysis with designed experiments

Jian (Jessie) Wu, Xuekun Sun, Z. J. Pei, X. Jack Xin, Kelli Simmelink. Soft-pad grinding of 300 mm wire-sawn silicon wafers: finite element analysis with designed experiments. IJMTM, 13(2/3/4):169-186, 2008. [doi]

Abstract

Abstract is missing.