Sih-Sian Wu, Kanwen Wang, Sai Manoj Pudukotai Dinakarrao, Tsung-Yi Ho, Mingbin Yu, Hao Yu. A thermal resilient integration of many-core microprocessors and main memory by 2.5D TSI I/Os. In Design, Automation & Test in Europe Conference & Exhibition, DATE 2014, Dresden, Germany, March 24-28, 2014. pages 1-4, IEEE, 2014. [doi]
@inproceedings{WuWDHYY14,
title = {A thermal resilient integration of many-core microprocessors and main memory by 2.5D TSI I/Os},
author = {Sih-Sian Wu and Kanwen Wang and Sai Manoj Pudukotai Dinakarrao and Tsung-Yi Ho and Mingbin Yu and Hao Yu},
year = {2014},
doi = {10.7873/DATE2014.190},
url = {http://dx.doi.org/10.7873/DATE2014.190},
researchr = {https://researchr.org/publication/WuWDHYY14},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {Design, Automation & Test in Europe Conference & Exhibition, DATE 2014, Dresden, Germany, March 24-28, 2014},
publisher = {IEEE},
}