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A High Level Approach to Co-Designing 3D ICs

Daniel Xing, Ankur Srivastava 0001. A High Level Approach to Co-Designing 3D ICs. In Vivek De, editor, Proceedings of the 61st ACM/IEEE Design Automation Conference, DAC 2024, San Francisco, CA, USA, June 23-27, 2024. ACM, 2024. [doi]

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