Thermal Impacts on NoC Interconnects

Sheng Xu, Ibis Benito, Wayne P. Burleson. Thermal Impacts on NoC Interconnects. In First International Symposium on Networks-on-Chips, NOCS 2007, 7-9 May 2007, Princeton, New Jersey, USA, Proceedings. pages 220, IEEE Computer Society, 2007. [doi]

Authors

Sheng Xu

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Ibis Benito

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Wayne P. Burleson

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