Sheng Xu, Ibis Benito, Wayne P. Burleson. Thermal Impacts on NoC Interconnects. In First International Symposium on Networks-on-Chips, NOCS 2007, 7-9 May 2007, Princeton, New Jersey, USA, Proceedings. pages 220, IEEE Computer Society, 2007. [doi]
@inproceedings{XuBB07,
title = {Thermal Impacts on NoC Interconnects},
author = {Sheng Xu and Ibis Benito and Wayne P. Burleson},
year = {2007},
doi = {10.1109/NOCS.2007.43},
url = {http://doi.ieeecomputersociety.org/10.1109/NOCS.2007.43},
researchr = {https://researchr.org/publication/XuBB07},
cites = {0},
citedby = {0},
pages = {220},
booktitle = {First International Symposium on Networks-on-Chips, NOCS 2007, 7-9 May 2007, Princeton, New Jersey, USA, Proceedings},
publisher = {IEEE Computer Society},
isbn = {978-0-7695-2773-4},
}