Sheng Xu, Ibis Benito, Wayne P. Burleson. Thermal Impacts on NoC Interconnects. In First International Symposium on Networks-on-Chips, NOCS 2007, 7-9 May 2007, Princeton, New Jersey, USA, Proceedings. pages 220, IEEE Computer Society, 2007. [doi]
No references recorded for this publication.
No citations of this publication recorded.