Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies - researchr publication authors

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Chuan Xu, Lijun Jiang, Seshadri K. Kolluri, Barry J. Rubin, Alina Deutsch, Howard Smith, Kaustav Banerjee. Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies. In 2009 International Conference on Computer-Aided Design (ICCAD 09), November 2-5, 2009, San Jose, CA, USA. pages 658-665, IEEE, 2009. [doi]

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