Chuan Xu, Lijun Jiang, Seshadri K. Kolluri, Barry J. Rubin, Alina Deutsch, Howard Smith, Kaustav Banerjee. Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies. In 2009 International Conference on Computer-Aided Design (ICCAD 09), November 2-5, 2009, San Jose, CA, USA. pages 658-665, IEEE, 2009. [doi]
@inproceedings{XuJKRDSB09,
title = {Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies},
author = {Chuan Xu and Lijun Jiang and Seshadri K. Kolluri and Barry J. Rubin and Alina Deutsch and Howard Smith and Kaustav Banerjee},
year = {2009},
url = {http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5361226},
tags = {modeling, analysis},
researchr = {https://researchr.org/publication/XuJKRDSB09},
cites = {0},
citedby = {0},
pages = {658-665},
booktitle = {2009 International Conference on Computer-Aided Design (ICCAD 09), November 2-5, 2009, San Jose, CA, USA},
publisher = {IEEE},
}