Analytical heat transfer model for thermal through-silicon vias

Hu Xu, Vasilis F. Pavlidis, Giovanni De Micheli. Analytical heat transfer model for thermal through-silicon vias. In Design, Automation and Test in Europe, DATE 2011, Grenoble, France, March 14-18, 2011. pages 395-400, IEEE, 2011. [doi]

Authors

Hu Xu

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Vasilis F. Pavlidis

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Giovanni De Micheli

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