Hu Xu, Vasilis F. Pavlidis, Giovanni De Micheli. Analytical heat transfer model for thermal through-silicon vias. In Design, Automation and Test in Europe, DATE 2011, Grenoble, France, March 14-18, 2011. pages 395-400, IEEE, 2011. [doi]
@inproceedings{XuPM11-0, title = {Analytical heat transfer model for thermal through-silicon vias}, author = {Hu Xu and Vasilis F. Pavlidis and Giovanni De Micheli}, year = {2011}, url = {http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=5763069}, researchr = {https://researchr.org/publication/XuPM11-0}, cites = {0}, citedby = {0}, pages = {395-400}, booktitle = {Design, Automation and Test in Europe, DATE 2011, Grenoble, France, March 14-18, 2011}, publisher = {IEEE}, isbn = {978-1-61284-208-0}, }