TSV Fault Modeling and A BIST Solution for TSV Pre-bond Test

Kangkang Xu, Yang Yu, Xiyuan Peng. TSV Fault Modeling and A BIST Solution for TSV Pre-bond Test. In 39th IEEE VLSI Test Symposium, VTS 2021, San Diego, CA, USA, April 25-28, 2021. pages 1-6, IEEE, 2021. [doi]

Abstract

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