A Novel Interconnection Architecture for Secured Die-to-Die Communication in System-in-Package - researchr publication authors

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Zhenyu Xu, Qing Yang 0001, Tao Wei. A Novel Interconnection Architecture for Secured Die-to-Die Communication in System-in-Package. In IEEE International Conference on Networking, Architecture and Storage, NAS 2022, Philadelphia, PA, USA, October 3-4, 2022. pages 1-7, IEEE, 2022. [doi]

This author has not been identified. Look up 'Zhenyu Xu' in GoogleThis author has not been identified. Look up 'Qing Yang 0001' in GoogleThis author has not been identified. Look up 'Tao Wei' in Google

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