Zhenyu Xu, Qing Yang 0001, Tao Wei. A Novel Interconnection Architecture for Secured Die-to-Die Communication in System-in-Package. In IEEE International Conference on Networking, Architecture and Storage, NAS 2022, Philadelphia, PA, USA, October 3-4, 2022. pages 1-7, IEEE, 2022. [doi]
@inproceedings{XuYW22,
title = {A Novel Interconnection Architecture for Secured Die-to-Die Communication in System-in-Package},
author = {Zhenyu Xu and Qing Yang 0001 and Tao Wei},
year = {2022},
doi = {10.1109/NAS55553.2022.9925351},
url = {https://doi.org/10.1109/NAS55553.2022.9925351},
researchr = {https://researchr.org/publication/XuYW22},
cites = {0},
citedby = {0},
pages = {1-7},
booktitle = {IEEE International Conference on Networking, Architecture and Storage, NAS 2022, Philadelphia, PA, USA, October 3-4, 2022},
publisher = {IEEE},
isbn = {978-1-6654-5408-7},
}