A Novel Interconnection Architecture for Secured Die-to-Die Communication in System-in-Package

Zhenyu Xu, Qing Yang 0001, Tao Wei. A Novel Interconnection Architecture for Secured Die-to-Die Communication in System-in-Package. In IEEE International Conference on Networking, Architecture and Storage, NAS 2022, Philadelphia, PA, USA, October 3-4, 2022. pages 1-7, IEEE, 2022. [doi]

Abstract

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