Full-Time Junction Temperature Extraction of IGCT Based on Electrothermal Model and TSEP Method for High-Power Applications

Chaoqun Xu, Biao Zhao, Xiangyu Zhang 0004, Zhengyu Chen, Jiapeng Liu, Wenpeng Zhou, Zhanqing Yu, Rong Zeng. Full-Time Junction Temperature Extraction of IGCT Based on Electrothermal Model and TSEP Method for High-Power Applications. IEEE Transactions on Industrial Electronics, 68(1):47-58, 2021. [doi]

@article{XuZZCLZYZ21,
  title = {Full-Time Junction Temperature Extraction of IGCT Based on Electrothermal Model and TSEP Method for High-Power Applications},
  author = {Chaoqun Xu and Biao Zhao and Xiangyu Zhang 0004 and Zhengyu Chen and Jiapeng Liu and Wenpeng Zhou and Zhanqing Yu and Rong Zeng},
  year = {2021},
  doi = {10.1109/TIE.2019.2962423},
  url = {https://doi.org/10.1109/TIE.2019.2962423},
  researchr = {https://researchr.org/publication/XuZZCLZYZ21},
  cites = {0},
  citedby = {0},
  journal = {IEEE Transactions on Industrial Electronics},
  volume = {68},
  number = {1},
  pages = {47-58},
}