The Classification of Wafer Defects: A Support Vector Machine with Different DenseNet Transfer Learning Models Evaluation

Lim Shi Xuen, Ismail Mohd Khairuddin, Mohd Azraai Mohd Razman, Jessnor Arif Mat-Jizat, Edmund Yuen, Haochuan Jiang, Eng Hwa Yap, Anwar P. P. Abdul Majeed. The Classification of Wafer Defects: A Support Vector Machine with Different DenseNet Transfer Learning Models Evaluation. In Jun Jo, Han-Lim Choi, Mardé Helbig, Hyondong Oh, Jemin Hwangbo, Chang Hun Lee, Bela Stantic, editors, Robot Intelligence Technology and Applications 7 - Results from the 10th International Conference on Robot Intelligence Technology and Applications, RiTA 2022, Daejeon, South Korea, 7-9 December, 2022. Volume 642 of Lecture Notes in Networks and Systems, pages 304-309, Springer, 2022. [doi]

Abstract

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