Contact testing of copper micro-pillars with very low damage for 3D IC assembly - researchr publication authors

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Onnik Yaglioglu, Ben Eldridge. Contact testing of copper micro-pillars with very low damage for 3D IC assembly. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-4, IEEE, 2013. [doi]

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