Onnik Yaglioglu, Ben Eldridge. Contact testing of copper micro-pillars with very low damage for 3D IC assembly. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-4, IEEE, 2013. [doi]
@inproceedings{YagliogluE13,
title = {Contact testing of copper micro-pillars with very low damage for 3D IC assembly},
author = {Onnik Yaglioglu and Ben Eldridge},
year = {2013},
doi = {10.1109/3DIC.2013.6702361},
url = {http://dx.doi.org/10.1109/3DIC.2013.6702361},
researchr = {https://researchr.org/publication/YagliogluE13},
cites = {0},
citedby = {0},
pages = {1-4},
booktitle = {2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013},
publisher = {IEEE},
}