Tadatomo Yamada, Ken Takano, Toshiaki Menjo, Shinya Takyu. Study of Optimizing Stress-Strain Curve of Adhesive for High Expansion Tape. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-4, IEEE, 2019. [doi]
@inproceedings{YamadaTMT19, title = {Study of Optimizing Stress-Strain Curve of Adhesive for High Expansion Tape}, author = {Tadatomo Yamada and Ken Takano and Toshiaki Menjo and Shinya Takyu}, year = {2019}, doi = {10.1109/3DIC48104.2019.9058827}, url = {https://doi.org/10.1109/3DIC48104.2019.9058827}, researchr = {https://researchr.org/publication/YamadaTMT19}, cites = {0}, citedby = {0}, pages = {1-4}, booktitle = {2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019}, publisher = {IEEE}, isbn = {978-1-7281-4870-0}, }