Tadatomo Yamada, Ken Takano, Toshiaki Menjo, Shinya Takyu. Study of Optimizing Stress-Strain Curve of Adhesive for High Expansion Tape. In 2019 International 3D Systems Integration Conference (3DIC), Sendai, Japan, October 8-10, 2019. pages 1-4, IEEE, 2019. [doi]
Abstract is missing.