Kosuke Yamashita, Shunji Kurooka, Koji Shirakawa, Yoshinori Hotta, Hirofumi Abe. Copper-filled anodized aluminum oxide a potential material for chip to chip bonding. In 2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015. IEEE, 2015. [doi]
@inproceedings{YamashitaKSHA15,
title = {Copper-filled anodized aluminum oxide a potential material for chip to chip bonding},
author = {Kosuke Yamashita and Shunji Kurooka and Koji Shirakawa and Yoshinori Hotta and Hirofumi Abe},
year = {2015},
doi = {10.1109/3DIC.2015.7334589},
url = {http://dx.doi.org/10.1109/3DIC.2015.7334589},
researchr = {https://researchr.org/publication/YamashitaKSHA15},
cites = {0},
citedby = {0},
booktitle = {2015 International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, August 31 - September 2, 2015},
publisher = {IEEE},
isbn = {978-1-4673-9385-0},
}