Improvement in high-temperature degradation by isotropic conductive adhesives including Ag-Sn alloy fillers

M. Yamashita, K. Suganuma. Improvement in high-temperature degradation by isotropic conductive adhesives including Ag-Sn alloy fillers. Microelectronics Reliability, 46(5-6):850-858, 2006. [doi]

Authors

M. Yamashita

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K. Suganuma

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