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M. Yamashita, K. Suganuma. Improvement in high-temperature degradation by isotropic conductive adhesives including Ag-Sn alloy fillers. Microelectronics Reliability, 46(5-6):850-858, 2006. [doi]
Possibly Related PublicationsThe following publications are possibly variants of this publication: Degradation by Sn diffusion applied to surface mounting with Ag-epoxy conductive adhesive with joining pressureM. Yamashita, K. Suganuma. mr, 46(7):1113-1118, 2006. [doi]
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