Improvement in high-temperature degradation by isotropic conductive adhesives including Ag-Sn alloy fillers

M. Yamashita, K. Suganuma. Improvement in high-temperature degradation by isotropic conductive adhesives including Ag-Sn alloy fillers. Microelectronics Reliability, 46(5-6):850-858, 2006. [doi]

Abstract

Abstract is missing.